1. 2. 3. material content data sheet sales product name tle82452sa issued 28. august 2013 ma# MA001139902 package pg-dso-36-54 weight* 2107.84 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 22.403 1.06 1.06 10628 10628 leadframe inorganic material phosphorus 7723-14-0 0.388 0.02 184 non noble metal zinc 7440-66-6 1.553 0.07 737 non noble metal iron 7439-89-6 31.066 1.47 14738 non noble metal copper 7440-50-8 1261.410 59.86 61.42 598439 614098 wire non noble metal copper 7440-50-8 2.515 0.12 0.12 1193 1193 encapsulation organic material carbon black 1333-86-4 1.516 0.07 719 plastics epoxy resin - 69.718 3.31 33076 inorganic material silicondioxide 60676-86-0 686.573 32.57 35.95 325724 359519 leadfinish non noble metal tin 7440-31-5 15.044 0.71 0.71 7137 7137 plating noble metal silver 7440-22-4 0.644 0.03 0.03 305 305 solder noble metal silver 7440-22-4 0.225 0.01 107 non noble metal tin 7440-31-5 0.150 0.01 71 non noble metal lead 7439-92-1 14.633 0.69 0.71 6942 7120 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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